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8 Layer HDI Blind Buried Half Hole PCB 1.0 MM Thickness

Categories Half Hole PCB
Brand Name: WITGAIN PCB
Model Number: Half hole PCB0017
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
Material:: FR4 TG>170
No of layers:: 8 Layer
PCB Kind: HDI PCB
PCB Thickness:: 1.0 MM
Surface technics:: Immersion Gold 2U'
Min Lind Space&Width:: 3/3 mil
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8 Layer HDI Blind Buried Half Hole PCB 1.0 MM Thickness

8 Layer HDI PCB Half Hole Blind And Buried Holes 1.0 MM Thickness


Board Info:


1 Part NO: Half hole PCB0017


2 Layer Count: 8 Layer PCB


3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM


4 Solder Mask: Green


5 Min Lind Space&Width: 3/3 mil


6 Application Area: GPS Module


7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L3-L6 0.15MM, L6-L7 0.1MM, L7-L8 0.1MM, L1-L2 0.2MM Blind and Buried Holes


Our Capabilities:


NOItemCapability
1Layer Count1-24 Layers
2Board Thickness0.1mm-6.0mm
3Finished Board Max Size700mm*800mm
4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
5Warp<0.7%
6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8Drill Hole Diameter0.1mm-6.5mm
9Out Layer Copper Thickness1/2OZ-8OZ
10Inner Layer Copper Thickness1/3OZ-6OZ
11Aspect Ratio10:1
12PTH Hole Tolerance+/-3mil
13NPTH Hole Tolerance+/-1mil
14Copper Thickness of PTH Wall>10mil(25um)
15Line Width And Space2/2mil
16Min Solder Mask Bridge2.5mil
17Solder Mask Alignment Tolerance+/-2mil
18Dimension Tolerance+/-4mil
19Max Gold Thickness200u'(0.2mil)
20Thermal Shock288℃, 10s, 3 times
21Impedance Control+/-10%
22Test CapabilityPAD Size min 0.1mm
23Min BGA7mil
24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

S1000-2 Data Sheet:


S1000-2
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC180
IPC-TM-650 2.4.24.4DMA185
TdIPC-TM-650 2.4.24.65% wt. loss345
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin20
T300IPC-TM-650 2.4.24.1TMAmin5
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
E-24/125MΩ.cm4.5 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
E-24/1251.7 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.38
125℃N/mm1.07
Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
CWIPC-TM-650 2.4.4AMPa518
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0
Cheap 8 Layer HDI Blind Buried Half Hole PCB 1.0 MM Thickness for sale
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