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HASL ENIG 10 Layer PCB Blind Buried Holes LED Printed Circuit Board

Categories 10 Layer PCB
Brand Name: WITGAIN PCB
Model Number: PCB000386
Certification: UL
Place of Origin: China
MOQ: 1pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100kpcs/Moth
Delivery Time: 20 days
Packaging Details: Vacuum package in bubble wrap
Layer Count: 10 Layer
Application: Consumer Electronics
Solder Mask: Green Solder Mask
Surface Treatment: Selective Immersion Gold
Drilling: Blind And Buried Holes
TG Degree: TG170
Surface finishing: HASL,ENIG,Gold finger,HASL Lead Free
Product name: Printed Circuit Board
Material: FR4 CEM1 CEM3 Hight TG,FR-4 High TG FR-4 PTFE
Type: Electronic Board
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HASL ENIG 10 Layer PCB Blind Buried Holes LED Printed Circuit Board

10 Layer Printed Circuit Board ISO 14001 Qualified Used In Medical Equipment


Main Features:


1 10 Layer customized printed circuit board manufacturered based on customer's gerber files.

2 Used in consumer electronics

3 Material is FR4 S1000-2 TG170.

4 The finished board thickness is 1.0MM.

5 The finished copper thickness is 1/H/H/H/H/H/H/H/H/1 OZ.

6 Surface treatment is ENIG 2U'.

7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L1-L10 0.2MM, L9-L10 0.1MM, L8-L9 0.1MM Laser Drilling

8 Lead time is around 20 working days.


Material Data Sheet:


S1000-2
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC180
IPC-TM-650 2.4.24.4DMA185
TdIPC-TM-650 2.4.24.65% wt. loss345
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin20
T300IPC-TM-650 2.4.24.1TMAmin5
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
E-24/125MΩ.cm4.5 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
E-24/1251.7 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.38
125℃N/mm1.07
Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
CWIPC-TM-650 2.4.4AMPa518
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

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