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ENIG 2U Motor Driver 10 Layer PCB Assembly Printed Circuit Board IATF 16949

Categories 10 Layer PCB
Brand Name: WITGAIN PCB
Model Number: 10LayerPCB0032
Certification: UL
Place of Origin: China
MOQ: 1pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100kpcs/Moth
Delivery Time: 20 days
Packaging Details: Vacuum package in bubble wrap
Board Thickness: 2.0MM
Application: Motors
Solder Mask: Green Solder Mask
Surface Treatment: ENIG 2U'
Material: FR4
TG Degree: TG180
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ENIG 2U Motor Driver 10 Layer PCB Assembly Printed Circuit Board IATF 16949

DC Motor Control PCB Assembly 10 Layer Printed Circuit Board IATF 16949


Material Data Sheet:


S1000-2
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC180
IPC-TM-650 2.4.24.4DMA185
TdIPC-TM-650 2.4.24.65% wt. loss345
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin20
T300IPC-TM-650 2.4.24.1TMAmin5
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
E-24/125MΩ.cm4.5 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
E-24/1251.7 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.38
125℃N/mm1.07
Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
CWIPC-TM-650 2.4.4AMPa518
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

Most PCB companies classify vias with a diameter less than 150 microns to be microvias. These vias lower the possibility of any type of manufacturing defect since they are drilled using lasers which mitigates the chances of any residue left after the process. Because of their small size and ability to connect one layer to the next they enable denser printed circuit boards with more complex designs. Most HDI printed circuit boards use microvias.


Microvias are used to connect one layer of the board to its adjacent layer and have a very small diameter in comparison to the mechanically drilled vias such as PTH (Plated Through Hole).


Microvias are of two types, Stacked and Staggered.


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