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| Categories | Grinding Wheel For Semiconductor And Photoelectricity |
|---|---|
| MOQ: | 1PC |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 20000 pcs per month capacity |
| Delivery Time: | 15-20 days delivery time |
| Packaging Details: | Box |
| Place of Origin: | China |
| Certification: | High QC standard, 100% inspection |
| Common Shape: | 6A2, 6A2T |
| Bond: | Vitrified |
| Application: | Semiconductor industry |
| Key word: | Back Thinning Wheels |
| Grit size: | Coarse Grit: 270--800 Finish Grit: 2000--8000 |
| Feature: | High efficiency |
| Company Info. |
| Xinzheng Dia Abrasives Co.,Ltd |
| View Contact Details |
| Product List |
The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.
Features:
Specification:
| Specifications: | Application | |||||||
| Common Shape | Wheel Size | Grit Size | Classic Specification | Industry | Workpiece&Material | Machine | Bond | Working Data |
| 6A2, 6A2T, 1A1 | OD: 175,195,209,305,255,355 | Coarse Grit: 270--800 Finish Grit: 2000--8000 | 6A2 175D 30T 76H 6A2 200D 35T 76H 6A2T 280D 30T 228.6H 1A1 40D 5T 18.7H | Semiconductor industry | Sapphire, silicon wafer | SHUWA, NTS, WEC, GALAXY. SPEEDFAM DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER | Vitrified Metal | |
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