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| Categories | Grinding Wheel For Semiconductor And Photoelectricity |
|---|---|
| MOQ: | 1PC |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 20000 pcs per month capacity |
| Delivery Time: | 10-14 days delivery time |
| Packaging Details: | Box |
| Place of Origin: | China |
| Certification: | High QC standard, 100% inspection |
| Assurance:: | quality warranty |
| Application: | Semiconductor and Photovoltaic industries |
| Feature: | High efficiency |
| Product Keywords: | Centerless Grinder Wheels |
| Wheel Size: | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm |
| Grit size: | Resin bond the finest grit size is 3000 |
| Company Info. |
| Xinzheng Dia Abrasives Co.,Ltd |
| View Contact Details |
| Product List |
Centerless grinding is a machining process that uses abrasive cutting to remove material from a workpiece. Centerless grinding differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of their rotation relative to each other determines the rate at which material is removed from the workpiece.
Centerless grinding is typically used in preference to other grinding processes for operations where many parts must be processed in a short time.
Features:
Specification:
| Common Shape | Wheel Size | Grit Size | Classic Specification |
| 1A1 | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm | Resin the finest grit size is 3000 |
Application
| Industry | Workpiece&Material | Machine | Bond | Working Data |
| Semiconductor and Photovoltaic industries | Ceramic, magnet, sapphire | Resin Vitrified |
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