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V Score Laser PCB Depaneling Machine FPC With Water Cooler

Categories Laser PCB Depaneling Machine
Brand Name: Winsmart
Model Number: SMTL300
Certification: CE
Place of Origin: China
MOQ: 1 set
Price: USD1-150K/set
Payment Terms: L/C, T/T, Western Union
Supply Ability: 100 sets per month
Delivery Time: 5-30 days
Packaging Details: Plywood case
Cutting Precision: ±5μm
Work Temp.: 25℃
Working Area: 300x300mm
Fixture: Customized
Laser Brand: Optowave
Name: PCB Laser Cutting Machine
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V Score Laser PCB Depaneling Machine FPC With Water Cooler

PCB Laser Cutting Machine Laser Depaneling of Assembled PCBs/FPCs


FAQ:

Q: What kind of PCBs are workable to use this machine?

A: FPC and FR4 panels, covering v score and tab boards.

Q: What is laser head of the machine?

A: We use USA Optowave laser.

Q: What kind of laser source you provide?

A: Green, CO2, UV and picosecond.

Q: What is cutting speed?

A: It depends on PCB material, thickness and cutting effect requirements.

Q: Does it cause dust during cutting?

A: No dust, but smoke, machine comes with exhaust system and water cooler


PCB Laser Cutting Machine Advantages:

1. No mechanical stress

2. Lower tooling costs

3. Higher quality of cuts

4. No consumables

5. Design versatility—simple software changes enable application changes

6. Works with any surface—Teflon, ceramic, aluminum, brass and copper


PCB Laser Cutting Machine Specification:


LaserQ-Switched diode-pumped all solid-state UV laser
Laser Wavelength355nm
Laser SourceOptowave UV 15W@30KHz
Positioning Precision of Worktable of Linear Motor±2μm
Repetition Precision of Worktable of Linear Motor±1μm
Effective Working Field300mmx300mm(Customizable)
Scanning Speed2500mm/s (max)
Working field40mmх40mm

PCB Laser Cutting Machine Cutting Materials

1. Flexible circuit boards, rigid circuit boards, rigid-flex circuit board sub-board processing.

2. Rigid, flexible circuit board sub-board processing component is installed.

3. Thin copper foil, a pressure-sensitive adhesive sheet (PSA), an acrylic film, a polyimide coating film.

4. Thickness of 0.6mm or less precision ceramic cutting, dicing; variety of cutting the base material (silicon, ceramics, glass, etc.)

5. Etching precision molding various functional films, an organic film and other precision cutting.

6. Polymer: polyimide, polycarbonate, polymethyl methacrylate, FR-4, PP, etc.

7. Functional film: gold, silver, copper, titanium, aluminum, chromium, ITO, silicon, poly-crystalline silicon, amorphous silicon and a metal oxide.

8. Brittle material: monocrystalline silicon, polycrystalline silicon, ceramic and sapphire.


PCB Laser Cutting Machine Cutting Result:


Cheap V Score Laser PCB Depaneling Machine FPC With Water Cooler for sale
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