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Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

Categories Integrated Circuit Inductor
Brand Name: Forewell
Model Number: CMLO0520H
Certification: ISO9001,ISO14001
Place of Origin: China
MOQ: 3000 pcs
Price: Negotiate
Payment Terms: T/T
Supply Ability: 1000000 pcs per lot
Delivery Time: 3-21days
Packaging Details: 12000/BOX
Rated current: 10A~3A
Package size: 5.4*5.2*2.0mm
Application: Next-generation mobile devices
Shipping: DHL UPS FedEx EMS,By air or by sea
Inductance: 0.68uH~10uH
Shape: or custom
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Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

SMD Alloy Powder Molded Chip Power Inductor Drum Core Fixed Inductor For Mobile Devices 0.68uH~10uH

SMD Power Inductor Original Smd Alloy Powder Molded Chip Integrated Circuit Ic 1.0uH~4.7uH


Features:

  • Magnetically shielded construction, low DC resistance;
  • The use of magnetic iron powder ensure capability for large current;
  • Low audible core noise;
  • Ideal for DC-DC converter applications in hand held personal computer and etc;
  • Frequency Range: up to 29MHz;
  • RoHS compliant
  • Reliable quality

Applications:

  • Smart phone,MID;
  • Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras;
  • Flat-screen TVs, blue-ray disc recorders, set top box;
  • Blue-ray disc recorders,
  • Telecomm base stations,communications.
  • Personal multimedia devices,consumer Products.
  • Telecomm base stations.
  • Communications

Specification:


temDescription
CategoryMolding Power Inductor
Inductance10.68uH~10uH
Current Rating (Amps)510A~3A
Size / Dimension5.4*5.2*2.0mm
Materialone-piece alloy powder

Dimensions

Specification


Packaging Information:

NOTES:

  • DC current (Idc) that will cause an approximate △T of 40℃
  • DC current (Isat) that will cause Lo to drop approximately 20%
  • All test data is referenced to 25℃ ambient
  • Operating Temperature Range -55℃ to +120℃
  • The part temperature (ambient + temp rise) should not exceed 120℃ under the worst operating conditions.
  • Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions
  • all affect the part temperature. Part temperature should be verified in the end application.

Packaging Quantity(pcs)


Cheap Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices for sale
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