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LCMXO2-1200UHC-4FTG256I Field Programmable Gate Array FPGA IC 79 65536 1280

Categories Integrated Circuit Chip
Brand Name: Original
Model Number: LCMXO2-1200UHC-4FTG256I
Certification: Original
Place of Origin: Original
MOQ: 1
Price: Negotiation
Payment Terms: TT
Supply Ability: 100
Delivery Time: 3-4days
Packaging Details: carton box
Number of LABs/CLBs: 160
Number of Logic Elements/Cells: 1280
Total RAM Bits: 75776
Number of I/O: 206
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
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LCMXO2-1200UHC-4FTG256I Field Programmable Gate Array FPGA IC 79 65536 1280

LCMXO2-1200UHC-4FTG256I Field Programmable Gate Array (FPGA) IC 79 65536 1280

Chips from factories. All are new and original. Pls inform us the part number and qty when to inquiry.

Specifications of LCMXO2-1200UHC-4FTG256I

TYPEDESCRIPTION
CategoryIntegrated Circuits (ICs)
Embedded
FPGAs (Field Programmable Gate Array)
MfrLattice Semiconductor Corporation
SeriesMachXO2
PackagingTray
Number of LABs/CLBs160
Number of Logic Elements/Cells1280
Total RAM Bits75776
Number of I/O206
Voltage - Supply2.375V ~ 3.465V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case256-LBGA
Supplier Device Package256-FTBGA (17x17)
Base Product NumberLCMXO2-1200

Features of LCMXO2-1200UHC-4FTG256I


Administrator:
• On-Chip User Flash Memory
• Up to 256 kbits of User Flash Memory
• 100,000 write cycles
• Accessible through WISHBONE, SPI, I2C and JTAG interfaces
• Can be used as soft processor PROM or as Flash memory
• Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
• Dedicated gearing logic
• 7:1 Gearing for Display I/Os
• Generic DDR, DDRX2, DDRX4
• Dedicated DDR/DDR2/LPDDR memory with DQS support
• High Performance, Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide range of interfaces:
– LVCMOS 3.3/2.5/1.8/1.5/1.2
– LVTTL
– PCI
– LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
– SSTL 25/18
– HSTL 18
– Schmitt trigger inputs, up to 0.5 V hysteresis
• I/Os support hot socketing
• On-chip differential termination
• Programmable pull-up or pull-down mode
• Flexible On-Chip Clocking
• Eight primary clocks
• Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)
• Up to two analog PLLs per device with fractional-n frequency synthesis
– Wide input frequency range (7 MHz to 400 MHz)
• Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single-chip, secure solution
• Programmable through JTAG, SPI or I2C
• Supports background programming of non-volatile memory
• Optional dual boot with external SPI memory
• TransFR™ Reconfiguration
• In-field logic update while system operates


Applications of LCMXO2-1200UHC-4FTG256I


The MachXO2 devices are designed on a 65 nm non-volatile low power process. The device architecture has several features such as programmable low swing differential I/Os and the ability to turn off I/O banks, on-chip PLLs and oscillators dynamically.



Environmental & Export Classifications of LCMXO2-1200UHC-4FTG256I

ATTRIBUTEDESCRIPTION
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
REACH StatusREACH Unaffected
ECCN3A991D
HTSUS8542.39.0001

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