ball grid array assembly bga

Brand Name:FASTPCBA

Model Number:FASTPCBA-004

Place of Origin:China

PCB Assembly SMT , BGA , DIP Double-Sided Pcb Assembly Factory Product description: Specializing in the production of high-precision and high- difficulty double-sided multilayer PCB circuit boards, double-sided multilayer PCB circuit board proofing batch ...

Brand Name:HNL-PCBA

Model Number:Rapid PCBA

Place of Origin:CHINA

OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...

Brand Name:YDY

Model Number:E-002

Place of Origin:China

Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly​ Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...

Brand Name:TELIT

Model Number:GL865-QUAD

Place of Origin:China

... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since

Brand Name:Bicheng

Model Number:BIC-462.V1.0

Place of Origin:CHINA

...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on

Brand Name:Bicheng Technologies Limited

Model Number:BIC-462-V7.8

Place of Origin:China

...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on

Model Number:Ball Grid Array (BGA) 63164-136T

Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flow of electricity. It is a type of contact ...

Brand Name:Suntek

Model Number:FPA8569-NE4

Place of Origin:China

New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...

Brand Name:FASTPCB

Place of Origin:CHINA

Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...

Brand Name:XILINX

Model Number:XC6SLX16-2FTG256C

Place of Origin:TW

XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...

Place of Origin:United States

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Brand Name:INTEL

Model Number:WP81341M0820

Place of Origin:USA

...: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encapsulated :Grid Array The power of: 1.2

Brand Name:Intel

Model Number:EP4CE40F23C8N

EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ...

Place of Origin:Shenzhen,China

Brand Name:ONESEINE

Model Number:ONE-102

BGA PCB printed circuit boards Assembly services Process Manufacturer in China BGA PCB Basic information: Material:Fr4 1.6mm Layer:6 Surface finish:Immersion gold Copper weight:70UM Assembly components:IC chips(484footprint) Testing:X-Ray Min line width 3mil Min line space 3mil Min hole 0.2mm Solder mask and silkscreen yes BGA PCB knowledge: BGA,means Ball Grid Array, Spherical pin grid array...

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:HSTECH

Model Number:HS-800

Place of Origin:China

...BGA Rework Station for Electronic Assembly​ Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential in electronics manufacturing and repair, allowing technicians to replace or repair BGAs...

Brand Name:WZ

Model Number:WZ-580C WZ-620C WZ-650C WZ-750C

Place of Origin:China

...Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made. The BGA rework station consists of several key components, including a heater, a

Brand Name:Yizhuo

Model Number:Aluminum Pcb Board 01

Place of Origin:China

..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:

Brand Name:ABIS

Model Number:H-PCB2

Place of Origin:China

...Assembly ISO14001 PCBA Electronic Pcb Assembly Technical capabilities: -PCBA Capacity Single and double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in. Assembly...

Brand Name:HighLeap

Model Number:PCBA

Place of Origin:China

...: 0.25mm Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Volume: