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SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

Categories PCBA Manufacturers
Brand Name: FASTPCBA
Model Number: FASTPCBA-004
Certification: ISO9001 / IATF16949 / ISO13485
Place of Origin: China
MOQ: 1
Price: 700-5000
Payment Terms: D/A, D/P, T/T, Western Union, MoneyGram, L/C
Supply Ability: 100000
Delivery Time: 5-8 work days
Packaging Details: Anti-static bag + white pearl cotton (used around the inside of the carton) + carton
Copper thickness: 0.25OZ~12OZ
Base material: FR-4
Material: FR4 CEM1 CEM3 Hight TG
Layer: 1~20 layers
Pcb standard: IPC-A-610 D/IPC-III Standard
Min. line spacing: 0.003"
Product name: Printed Circuit Board
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SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

PCB Assembly SMT , BGA , DIP Double-Sided Pcb Assembly Factory


Product description:
Specializing in the production of high-precision and high- difficulty double-sided multilayer PCB circuit boards, double-sided multilayer PCB circuit board proofing batch production and processing manufacturers, fastpcba



Our product manufacturing capabilities:

PCB process capability
ItemLarge processing capacitySmall processing capacity
Layers (maximum)2--1820-30
Plate typeFR-4, ceramic plate, aluminum base platePTFE,PPO ,PPE
Teflon, halogen-free sheet, high Tg sheet
Rogers, etc TeflonE-65,ect
Plate mixed pressure4 layers-6 layers6 layers-8 layers
biggest size610mm X 1100mm  
Dimensional accuracy±0.13mm±0.10mm
Board thickness range0.2mm--6.00mm0.20mm--8.00mm
Board thickness tolerance (t≥0.8mm)±8%±5%
Board thickness tolerance (t <0.8mm)±10%±8%
Medium thickness0.076mm--6.00mm0.076mm--0.100mm
Minimum line width0.10mm0.075mm
Minimum distance0.10mm0.075mm
Outer copper thickness8.75um--175um8.75um--280um
Inner copper thickness17.5um--175um8.75um--175um
Drilling hole diameter (mechanical drill)0.25mm--6.00mm0.15mm--0.25mm
Hole diameter (mechanical drill)0.20mm--6.00mm0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)0.05mm
Hole position tolerance (mechanical drill)0.075mm0.050mm
Laser drilling aperture0.10mm0.075mm
Plate thickness aperture ratio10:0112:01
Solder mask typeSensitive green, yellow, black, purple, blue, ink
Minimum solder mask width0.10mm0.075mm
Minimum solder mask isolation ring0.05mm0.025mm
Plug hole diameter0.25mm--0.60mm0.60mm-0.80mm
Impedance tolerance±10%±5%
Surface treatment typeHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger cardChemical sinking tin, OSP

Our production equipment: the advanced level of the equipment determines the product quality and efficiency:


Product 100 testing:


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