Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
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...Glue Epoxy Potting Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin 1311 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. Potting...
Chongqing Aorun Industrial Co., Ltd.
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High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK TIS280-03A/B
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...fire resistant Silica encapsulant glue.This potting glue to apply on LED chip seal, LED ligh bar,and for any king of LED lighting porer or substrate cure.Their flexibility and elasticity ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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High Precision Ab Part Potting Compound Machine for Electronic Components Encapsulation
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...dispensing system. No matter what your resin application requirements look like: we can do most of them in our fully equipped lab. We can handle 1- and 2-component polyurethanes, epoxies, acrylics, silicones, temperature, humidity and UV curing materials....
Guangzhou Zhengqi Technology Co., Ltd.
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High Precision Glue Potting Machine Electronic Components Glue Dispensing Equipment
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2 part components High speed shearing chemical glue make machine mixing equipment After-sell service: On-site installation and training. Free training: during the installation and debugging of the equipment, engineer provide free training to the technical ......
Shenzhen Horizons Technology Co., Ltd
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Manufacture Thermal Conductive Silicone Potting For Electronic Components
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Manufacture Thermal Conductive Silicone Potting For Electronic Components TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
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...Encapsulant MCSIL-E160 A/B RTV2 Silicone Potting Compound for Electronics Description of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160 Silicone compound is supplied as a two-component addition cure system. It consists of Part A and Part B. The component A is white and component......
MINGCHENG GROUP LIMITED
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silicone potting encapsulating adhesive sealant for solar cell, LED power electronic components
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...component silicone potting encapsulating adhesive sealant for solar cell, LED power electronic components ∎Product Description ●SI8230 is two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components...
Shanghai Max Tech Co.,Ltd
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Polyurethane Two-Component Potting Machine Casting Resin Dispensing Machine Electronic Potting Glue Mixing Machine
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...Component Potting Machine Casting Resin Dispensing Machine Electronic Potting Glue Mixing Machine Potting is a method for processing resins based on silicone, polyurethane or epoxy in liquid form to cover electrical components such as PCBs or for filling out cavities. The precise operation of metering and mixing systems is particularly important for resin casting in the electrical and electronic......
Kapudun Automation Equipment (Guangzhou)CO.,ltd
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6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound
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6202 (HT6202T) double component heat curing epoxy potting adhesive is for Automobile ignition coil potting 202 (HT6202T) double component heat curing epoxy potting adhesive is two components, heating curing, translucent, automobile ignition coil epoxy ......
Shanghai Huitian New Material Co., Ltd
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TIE280-12AB Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive
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... cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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