SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing
![]() |
PCB Assembly SMT , BGA , DIP Double-Sided Pcb Assembly Factory Product description: Specializing in the production of high-precision and high- difficulty double-sided multilayer PCB circuit boards, double-sided multilayer PCB circuit board proofing batch ......
FASTPCBA Co., Ltd.
|
Aluminum PCB Prototyping FR4 Rapid PCBA Ball Grid Array Assembly
![]() |
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ......
Beijing Haina Lean Technology Co., Ltd
|
Stencil SMT Pcba Prototype Aoi Testing Pcb Sourcing Ball Grid Array Assembly
![]() |
Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our......
Shenzhen Yideyi Technology Limited Company
|
GL865-QUAD TELIT Smallest GSM/GPRS ball grid array module
![]() |
... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since...
Shenzhen Hongxinwei Technology Co., Ltd
|
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
![]() |
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Bicheng Electronics Technology Co., Ltd
|
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
![]() |
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Shenzhen Bicheng Electronics Technology Co., Ltd
|
63164-136T BGA Azimuth Carrier Test Socket Ball Grid Array Azimuth Socket With Electrical Contactor
![]() |
Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flow of electricity. It is a type of contact ......
Krunter Future Tech (Dongguan) Co., Ltd.
|
Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection
![]() |
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ......
Suntek Electronics Co., Ltd.
|
Bom Gerber Files Ball Grid Array Bga Pcb Assembly Service Fastpcba Instrument And Meter
![]() |
Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ......
Quanhong FASTPCB
|
XILINX XC6SLX16-2FTG256C Bga Ball Grid Array Processor Embedded
![]() |
XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ......
Shenzhen GS Electronic Technology Co., Ltd. CN
|