Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design

Features:

• High speed, accurate solidification capacity ±10um@3σ;
• High production efficiency, low cost input
• High multi-chip processing capacity, support 16 different types of chip placement
• High flexibility to support multiple carrier operations
• Can work in different plane heights, support deep cavity work
• Modular platform design, small appearance, small footprint

Product advantage:

High precision Accuracy: ±10μm@3σ Angle: ±0.15°@3σ High precision linear motor
Waffle pack / Gel-Pak Supports 16 Waffle packs (2 "x 2") 4”x 4”size is available.
Automatic height measurement Accuracy: 3μm Supports a variety of probes Can be replaced with laser altimeter according to demand
Nozzle station Quick automatic nozzle change Supports 7 nozzle stations.
Visual recognition 2448x2048 resolution 256 gray level Support gray value template, custom shape template The platform can be positioned twice. The Angle error is ±0.01deg.
Deep cavity operation Work at different plat heights. The maximum depth is 11mm.

Features of dispensing function:

• Supports various types of epoxy adhesives
• Meet various graphic dispensing needs
• Comes with commonly used standard graphics library
• Support custom graphics library

Product parameters:

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

5.The ground is required to withstand a pressure of 800kg/m².

Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering machine, vertical oven, printer and etc has always maintained a leading position in technology, and provided professional electronic equipment solutions for many well-known enterprises at home and abroad.

With modern industrial parks and advanced R&D facilities, Suneast technology has strong system integration capabilities in R&D, design, production, automation and information equipment manufacturing. Its sales network is all over the world. Suneast technology has been achieved technical strategic cooperation with Tsinghua University, Chinese University of Hong Kong, Hong Kong University of Science and Technology and Harbin Institute of Technology, and its R&D capabilities has reached the advanced level at home and abroad.

In the core area of Guangdong-Hong Kong-Macao Greater Bay Area, Suneast technology has served semiconductor back-end application customers for more than 40 years, its downstream and end customers include Huawei, ZTE, TCL, Hikvision, MLS LIGHTING, DBG, DESAYSV AUTOMOTIVE, SHENZHEN MTC, JFLED, etc.

The dual drive gantry synchronous follow linear motor technology has been successfully applied to a number of high-speed and high-precision equipment manufacturing and processing fields, and gains great praise by users. The new semiconductor packaging equipment, like chip bonder is the masterpiece of Suneast technology, which helps the development of domestic chip industry. Today, Suneast technology has become the leader of China's intelligent equipment industry.

As the core enterprise of Sino ICT Holdings, Suneast technology will strengthen the strategic goal of the group and become a world-class enterprise in the field of high technology.

Culture

Vision

To be the leader in the global SMT intelligent equipment industry and the champion in the semiconductor equipment sub-industry!

Maintain leading technology level, R&D strength, industrial scale, and management model, and become the leader of the global SMT intelligent equipment industry and the champion of the semiconductor equipment sub-industry!

  Mission