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High-Performance Communication PCB Assembly for Wireless Routers and Base Stations Suntek Group

Categories Communication PCB Assembly
Brand Name: Suntek Electronics Co., Ltd
Model Number: 2024-PCBA-130
Certification: ISO9001 ISO13485 IATF16949 UL
Place of Origin: China or Cambodia
MOQ: 1pcs
Price: Customized products
Payment Terms: TT,Paypal
Delivery Time: 5-7days after all components kitted
Packaging Details: By ESD bags and carton
Layer: 4 Layers
Warranty: 1 year
Impedance control: Yes
Surface Finish: Lead Free HASL
LW/LS min.: 0.05mm
Material: FR4
Copper: 1OZ
Thickness: 0.4mm-3mm
X-RAY inspection: For BGA,OFN,QFP with bottom pads
silkscreen color: white,black
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High-Performance Communication PCB Assembly for Wireless Routers and Base Stations Suntek Group

High-Performance Communication PCB Assembly for Wireless Routers and Base Stations Suntek Group


Suntek Contract Factory:


Located in Development Zone-Changsha City, Suntek is one of the leading suppliers of EMS and has been providing support in PCB assembly and cable assembly field for more than 10 years. With ISO 9001:2015,ISO13485,IATF16949 and UL certified,we supply qualified products with competitive prices to clients all over the world.


Capabilities overview:

Product NamePCB Assembly
Surface FinishedENIG
Pcb Layers2 Layers
Minimum Hole Tolerance±0.05mm
Plugging Vias Capability0.2-0.8mm
Pcba TestAOI, X-RAY, ICT and Function Test
ServicePCB & PCBA
Pcb Thickness0.2-7.0mm
Pcb ProcessImmersion Gold
Pcb Assembly MethodBGA
Material Precision0402+QFN+QFP

With the rapid development of information and communication technologies, electronic devices like smartphones, wireless routers, base stations and other communication equipment have become indispensable in daily life and work. The printed circuit boards in these devices serve as the foundation for assembly of components and integrated circuits, enabling the transmission of high-speed signals and data that make communication possible.


Communication device PCBs facilitate interconnections between active and passive components using conductive copper traces etched from copper-clad laminate boards. They provide mechanical support and the necessary electrical connections dictated by the intended functioning of the device. But most importantly, PCBs designed for communications applications must transmit signals accurately and reliably between components, without unacceptable loss or interference. This requires specialized materials and fabrication processes to serve the unique demands of high-frequency communication electronics.


Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.

Here are the most common applications of the telecommunication industry that make efficient use of PCBs:

  • Wireless communication systems
  • Mobile phone tower systems
  • Telephonic switching systems
  • PBX systems
  • Industrial wireless communication technology
  • Technology for commercial phones
  • Video conferencing technologies
  • Communication technology used in space
  • Cell transmission and tower electronics
  • High speed servers and routers
  • Electronic data storage devices
  • Mobile communication systems
  • Satellite systems and communication devices
  • Video collaboration systems
  • Land wired communication systems
  • Technology for commercial phones
  • Digital and analog broadcasting systems
  • Voice over Internet Protocol (VoIP)
  • Signal boost systems (online)
  • Security technology and information communication systems

Why is FR-4 still commonly used if industrial PCBs face extreme temperatures?

While special substrates like polyimides and ceramics handle wider temperature swings, FR-4 laminates have evolved “high Tg” versions usable to 150°C+ along with lower cost and better fabricator familiarity. So FR-4 remains an option for many industrial applications not hitting extreme temps.



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