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High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Categories Thermal Conductivity Sharp Metal
Brand Name: Ziitek
Model Number: TS-Ziitek-Sharp Metal X01
Certification: RoHs
Place of Origin: China
MOQ: 1000PCS
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bay
Name: High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Color: Silvery white
Thermal Conductivity: 15.3~18.9W/mK
Composition: Alloy
Temperature range: -45℃~250℃
Density: 8.0g/cm³
Keywords: Phase Changing Materials
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High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets


TS-Ziitek-Sharp Metal x01 is a new type of alloy phase changing heat conduction product made from a mixture of several metals, designed to solve heat dissipation and reliability problems.


TS-ZiiteK-Sharp Metal X01 is not easy to evaporate, safe and non-toxic, stable in physical and chemical properties, and has high thermal conductivity etc.When the phase change temperature is higher than its phase change temperature,the phase change material begins to softening and phase change, and can be filled to the tiny irregular contact surface of the device.Form a very small contact thermal resistance interface, to achieve good heat.


Features


>Good thermal conductivity
>Non-toxic and environmentally safe

>Excellent long term stability
>Ensure low thermal resistance.


Applications


>Microprocessors

>Chipsets

>Graphic processing chips

>Set Top Box
>LED

Typical Properties of TS-Ziitek-Sharp Metal X01 Series
PropertyValueTest Method
ColorSilvery whiteVisual
CompositionAlloy****
Density (g/cm³)8.0ASTM D792 @25℃
7.9ASTM D792 @80℃
Thermal conductivity(W/mK)18.9ISO22007-2.2 @25℃
15.3ISO22007-2.2 @80℃
Specific heat capacity(J/g℃)0.24ASTM E1269@25℃
0.26ASTM E1269@80℃
Resistivity (Ω-m)<10-7ASTM D257
Continuous Use Temp(℃)-45 to 250℃Ziitek Test Method
Phase Change Temperature Range(℃)>60ASTM D3418
Solidification Range(℃)<57ASTM D3418

Storage Method
Recommended storage in a warehouse environment at 18-30°C, with maximum humidity notexceeding 70%.


Usage lnstructions
Avoid contact with aluminum or metal surfaces.
After applying X01, use a compatible thermal pad or foam to enclose and secure the area along the edges of the liquid metal, ensuring it remains contained without leaking or spreading.


Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Independent R&D team


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