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TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF100 10055-62
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics
Thermal conductivity: 10.0W/mK
Hardness: 55 Shore 00
Materials: Ceramic filled silicone elastomer
Keywords: Silicone Thermal Pad
Sample: Sample free
Specific Gravity: 3.4g/cc
Application: Electronic Components Heat Sinks
Flame rating: 94V-0
Color: Gray
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  • Product Details
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TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics

TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics


Product descriptions


TIF®100 10055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling efficient heat tansfer from discrete components or the entire PCB to the metal housing or heat sink ,This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.


Features:


> Excellent thermal conductivity 10.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

Typical Properties of TIF®100 10055-62 Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.4g/ccASTM D297
thickness0.02"(0.50mm)~0.200"(5.00mm)ASTM D374
Hardness (thickness<1.0mm)55(Shore 00)ASTM 2240
Continuos Use Temp-40 to 200℃******
Dielectric Breakdown Voltage≥5000 VACASTM D149
Dielectric Constant7.0MHzASTM D150
Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity10.0W/m-KASTM D5470
Product Specification
Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory to alternate thickness.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

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