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High Clarity Optical Borosilicate Glass Substrates In Semiconductor

Categories Optical Window
Brand Name: LONGWAY
Model Number: KK253122
Certification: ISO9001
Place of Origin: China
MOQ: 500 pieces
Price: NEGOTIATION
Payment Terms: D/P,T/T,Western Union
Supply Ability: 30000 Pieces per Month
Packaging Details: electrolytic capacitor paper,foam,carton
Shape: Flat
Surface: Clear and transparent
Transmission: >90%
Coating: Available
Processing: Polishing
Application: Optics
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High Clarity Optical Borosilicate Glass Substrates In Semiconductor



High Clarity Optical Borosilicate Glass Substrates In Semiconductor


Material:

  • Base Composition: Primarily silicon dioxide (SiO₂) and boron trioxide (B₂O₃) , with minimal alkali content.

  • Manufacturing: Produced via continuous melting in platinum-lined furnaces to ensure extreme purity and homogeneity. Often polished to sub-nanometer surface roughness.

  • Key Additives: Precise additions of alumina (Al₂O₃) for chemical stability and refining agents to eliminate bubbles/impurities.

Key Properties:

  1. Exceptional Optical Clarity: Ultra-high light transmission (>90%) across UV to NIR spectra (e.g., 185nm-2μm), minimal autofluorescence.

  2. Low Thermal Expansion (CTE): Extremely low CTE (∼3.3 × 10⁻⁶/K at 20°C), matching silicon wafers to prevent stress-induced failure during thermal cycling.

  3. Superior Thermal & Chemical Resistance: Withstands aggressive semiconductor processes:

    • Thermal: Stable up to 500°C; resists thermal shock from rapid heating/cooling.

    • Chemical: Inert to acids, alkalis, and solvents (e.g., photoresist developers, etchants).

  4. High Surface Quality: Near-atomic smoothness (<0.5nm Ra) critical for nanolithography and thin-film deposition.

  5. Low Ionic Contamination: Minimal alkali ion migration (Na⁺, K⁺) prevents device contamination.

  6. Mechanical Stability: High Young’s modulus (∼64 GPa) ensures dimensional rigidity under processing stress.

Primary Function:

  • To serve as an ultra-stable, inert platform for semiconductor fabrication processes.

  • Provides a defect-free surface for high-resolution patterning (e.g., EUV photomasks).

  • Acts as a protective window for sensors and optics in harsh environments.

  • Enables precise light transmission for inspection, metrology, and lithography systems.

Main Applications in Semiconductor:

  1. Photomask Blanks: Base material for EUV/ArF photolithography masks requiring near-zero defects.

  2. MEMS & Sensor Covers: Hermetic sealing caps for pressure sensors, IR detectors, and MEMS devices.

  3. Wafer Handling Components: Carrier plates, inspection windows, and alignment stages in wafer processing tools.

  4. Advanced Packaging: Interposers and substrates for 2.5D/3D IC integration.

  5. Process Equipment Optics: Lenses, viewports, and mirrors in plasma etchers, CVD chambers, and laser tools.

  6. Metrology & Inspection: Critical for high-precision alignment systems and defect scanners.

In essence: High Clarity Optical Borosilicate Glass Substrates are ultra-pure, thermally stable engineered materials essential for semiconductor manufacturing. Their unique combination of near-perfect optical transmission, near-zero thermal expansion, chemical inertness, and atomic-level surface flatness enables nanometer-scale precision in photolithography, protects sensitive components, and ensures reliability in extreme process environments. These substrates directly support yield and performance in advanced nodes (e.g., sub-5nm), MEMS production, and next-generation packaging.


ItemGlass disc, Glass wafer, Glass substrate
MaterialOptical glass, Qurartz glass, borosilicate glass, Float glass, borofloat
Diameter Tolerance+0/-0.2 mm
Thickness Tolerance+/-0.2 mm
ProcessedBy Cutting,Grinding,Tempering, Polishing
Surface Quality80/50,60/40,40/20
Material QualityNo scratches and air bubble
Transmission>90% for visible light
Chamfer0.1-0.3 mm x 45 degree
Surface CoatingAvailable
UsagePhotography, Optics, Lighting system, industrial area.







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