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| Categories | High Temperature PCB |
|---|---|
| Brand Name: | Bicheng Technologies Limited |
| Model Number: | BIC-503-V0.53 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD 2.99-9.99 PER PIECE |
| Payment Terms: | T/T, Western Union |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 10 working days |
| Packaging Details: | Vacuum |
| Number of Layers: | 4 |
| Glass Epoxy:: | TU-768 |
| Final foil: | 1.5 Oz |
| Final height of PCB:: | 1.6mm ±10% |
| Surface Finish: | Immersion gold |
| Solder Mask Color:: | Green |
| Colour of Component Legend: | White |
| Test: | 100% Electrical Test prior shipment |
High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. Soldering pads are coated with immersion gold and non-pads are with green solder mask. The panel consists of 16 boards with a size of 320 x 280mm. The core is 0.8mm thick, finished PCB achieves 1.2mm thick.
Main Applications
Consumer Electronics
Server, workstation
Automotive
PCB Specifications
| Item | Description | Requirement | Actual | Result |
| 1. Laminate | Material Type | FR-4 TU-768 | FR-4 TU-768 | ACC |
| Tg | 170℃ | 170℃ | ACC | |
| Supplier | Taiwan Union (TU) | Taiwan Union (TU) | ACC | |
| Thickness | 1.2±10% mm | 1.18-1.21mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25µm | 26.15µm | ACC |
| Outer copper | 35µm | 37.85µm | ACC | |
| Inner Copper | 30µm | 31.15µm | ACC | |
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | PSR-2000GT600D | ACC |
| Color | Green | Green | ACC | |
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |
| S/M Thickness | ≥10µm | 19.55µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC |
| Color | White | White | ACC | |
| Location | C/S, S/S | C/S, S/S | ACC | |
| 5. Peelable Solder Mask | Material Type | |||
| Thickness | ||||
| Location | ||||
| 6. Identification | UL Mark | YES | YES | ACC |
| Date Code | WWYY | 0421 | ACC | |
| Mark Location | Solder Side | Solder Side | ACC | |
| 7. Surface Finish | Method | Immersion Gold | Immersion Gold | ACC |
| Tin Thickness | ||||
| Nickel Thickness | 3-6µm | 5.27µm | ACC | |
| Gold Thickness | 0.05µm | 0.065µm | ACC | |
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC |
| REACH | Directive 1907 /2006 | OK | ACC | |
| 9.Annular Ring | Min. Line Width (mil) | 6mil | 5.8mil | ACC |
| Min. Spacing (mil) | 5mil | 5.2mil | ACC | |
| 10.V-groove | Angle | 30±5º | 30º | ACC |
| Residual thickness | 0.4±0.1mm | 0.39mm | ACC | |
| 11. Beveling | Angle | |||
| Height | ||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC |
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |
| Warp and Twist | ≦0.7% | 0.32% | ACC | |
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC |
| Solvent Test | No Peeling | OK | ACC | |
| Solderability Test | 265 ±5℃ | OK | ACC | |
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.58µg/c㎡ | ACC |
|
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