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TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-030.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: TLX-8
Layer count: 2 layers
PCB thickness: 1.6mm
PCB size: 99 x 88mm=1PCS
Solder mask: Green
Silkscreen: White
Copper weight: 1oz
Surface finish: OSP
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TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating


Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.


TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.


TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.


Data Sheet of TLX-8

TLX-8 TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK @10 GHzIPC-650 2.5.5.32.552.55
Df @1.9 GHzIPC-650 2.5.5.5.10.00120.0012
Df @10 GHzIPC-650 2.5.5.5.10.00170.0017
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Flexural Strength(MD)ASTM D 709psi28,900N/mm2
Flexural Strength(CD)ASTM D 709psi20,600N/mm2
Tensile Strength(MD)ASTM D 902psi35,600N/mm2
Tensile Strength(CD)ASTM D 902psi27,500N/mm2
Elongation at Break(MD)ASTM D 902%3.94%3.94
Elongation at Break(CD)ASTM D 902%3.92%3.92
Young's Modulus(MD)ASTM D 902kpsi980N/mm2
Young's Modulus(CD)ASTM D 902kpsi1,200N/mm2
Young's Modulus(MD)ASTM D 3039kpsi1,630N/mm2
Poisson's RatioASTM D 30390.135N/mm
Peel Stength(1 oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch15N/mm
Peel Stength(1 oz.RTF)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch17N/mm
Peel Stength(½ oz.ed)IPC-650 2.4.8.3(Elevated Temp.)Ibs./linear inch14N/mm
Peel Stength(½ oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch11N/mm
Peel Stength(1 oz.rolled)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch13N/mm2.1
Thermal ConductivityASTM F433/ASTM 1530-06W/M*K0.19W/M*K0.19
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(After Bake.)mils/in.0.06mm/M
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.4(After Bake.)mils/in.0.08mm/M
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.09mm/M
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.1mm/M
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm6.605 x 108Mohm6.605 x 108
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm3.550 x 106Mohm3.550 x 106
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm/cm1.110 x 1010Mohm/cm1.110 x 1010
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm/cm1.046 x 1010Mohm/cm1.046 x 1010
CTE(X axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/21ppm/21
CTE(Y axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/23ppm/23
CTE(Z axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/215ppm/215
Density(Specific Gravity)ASTM D 792g/cm32.25g/cm32.25
Td(2% Weight Loss)IPC-650 2.4.24.6(TGA)535
Td(5% Weight Loss)IPC-650 2.4.24.6(TGA)553
Flammability RatingUL-94V-0V-0

There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).



The benefits of TLX-8 material:

(1) Excellent mechanical & thermal properties

(2) Low & stable DK

(3) Dimensionally stable

(4) Low moisture absorption

(5) UL 94 V-O rating

(6) Tightly controlled DK

(7) Low DF

(8) For low layer count microwave designs


There are some applications:

(1) Antennas

(2) Couplers, Splitters, Combiners,

(3) Amplifiers, Mixers, Filters

(4) Passive components


PCB Specifications

PCB SIZE99 x 88mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
TLX-8 1.575mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:15 mil / 10 mil
Minimum / Maximum Holes:0.5mm/2.0mm
Number of Different Holes:N/A
Number of Drill Holes:N/A
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:TLX-8 1.575mm
Final foil external:1 oz
Final foil internal:N/A
Final height of PCB:1.6 mm ±10%
PLATING AND COATING
Surface FinishOSP
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAN/A
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

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