| Sign In | Join Free | My ecer.jp |
|
| Sign In | Join Free | My ecer.jp |
|
| Categories | High TG PCB |
|---|---|
| Brand Name: | Bicheng |
| Model Number: | BIC-481.V1.0 |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Base material: | FR-4 |
| Layer count: | 8 layers |
| PCB thickness: | 1.6mm ±0.16 |
| PCB size: | 210.72 x 212.42mm=1UP |
| Solder mask: | Green |
| Silkscreen: | White |
| Copper weight: | 1oz |
| Surface finish: | Immersion gold |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
| Number of Layers | 8 |
| Board Type | Multilayer PCB |
| Board size | 210.72 x 212.42mm=1UP |
| Board Thickness | 1.60 mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170℃ |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAIYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 5.8 mil |
| Minimum Gap(mil) | 5.4 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
| Drill table (mm) | |
| T1 | 0.450 |
| T2 | 0.600 |
| T3 | 0.800 |
| T4 | 0.900 |
| T5 | 0.950 |
| T6 | 1.000 |
| T7 | 1.250 |
| T8 | 1.300 |
| T9 | 1.400 |
| T10 | 1.600 |
| T11 | 1.700 |
| T12 | 2.000 |
| T13 | 2.550 |
| T14 | 3.000 |
| T15 | 3.250 |
| T16 | 3.500 |
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
| 66 | Contour process | Method of contour process | CNC milling, V-CUT, Break-out tap, break-out holes, Punching | ||
| 67 | Minimum router | 0.8mm | |||
| 68 | Min.tolerance of contour | ±0.15mm | ±0.13mm | ±0.1mm | |
| 69 | Min.distance of milling contour(no copper exposure) | 12mil | 10mil | 8mil | |
| 70 | Angle of V-CUT | 20,30,45,60 ±5 degree | |||
| 71 | Degree of symmetry of V-CUT | ±6mil | ±5mil | ±4mil | |
| 72 | Tolerance of residual thickness of V-CUT | ±6mil | ±5mil | ±4mil | |
| 73 | Tolerance of Chamfer angle of Gold finger | ±5 degree | ±5 degree | ±5 degree | |
| 74 | Tolerance of residual thickness of bevel edge of gold finger | ±5mil | ±5mil | ±5mil | |
| 75 | Min radius of inner corner | 0.4mm | |||
| 76 | Min. distance from edge to V-Cut (no copper exposure) | 18mil (1.6mm Thick, 20 degree V-groove cutter) | 14mil(1.6mm Thick, 20 degree V-groove cutter) | 12mil (1.6mm Thick, 20 degree V-groove cutter) | |
| 77 | 20mil (1.6mm Thick, 30 degree V-groove cutter) | 18mil (1.6mm Thick, 30 degree V-groove cutter) | 16mil (1.6mm Thick, 30 degree V-groove cutter) | ||
| 78 | 24mil (1.6mm Thick, 45 degree V-groove cutter) | 22mil (1.6mm Thick, 45 degree V-groove cutter) | 20mil (1.6mm Thick, 45 degree V-groove cutter) | ||
| 79 | 30mil (1.6mm Thick, 60 degree V-groove cutter) | 28mil (1.6mm Thick, 60 degree V-groove cutter) | 26mil (1.6mm Thick, 60 degree V-groove cutter) | ||
|
3 Layer Hybrid PCB 13.3mil RO4350B And 31mil RT Duroid 5880 High TG PCB
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster
Immersion Gold FR4 High TG PCB With HASL Leadfree Surface Finishing
PCB with Peelable Mask Double Sided Circuit Board Built on Tg170 FR-4 Coating HASL.
Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
Rogers 4360 High Frequency PCB 16mil Double Sided RF PCB with Green Mask and Immersion Gold for Small Cell Transceivers
Rogers RO4360 RF PCB 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas
Immersion Gold Printed Circuit High TG PCB With 90Ohm Impedance Control
