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HDF1575M P2 Saw Bandpass Filter

Categories	Saw Bandpass Filter
Brand Name:	HD
Model Number:	1575.42MHZ
Place of Origin:	wuxi
MOQ:	1000
Price:	$0.2
Payment Terms:	MoneyGram
Supply Ability:	1000000
Delivery Time:	25 day
Packaging Details:	REEL
Certification:	ISO ROHS
Center Frequency:	1575.42Mhz
Insertion Loss(F0±1.2 MHz):	0.9(TYPE) 1.3(MAX)
Ripple Level(F0±1.2 MHz）:	0.1（type） 0.5（max）
Attenuation（D.C~1425MHz）:	30dB（min） 35dB（type）
Attenuation（1425-1500Mhz）:	38dB (min) 42dB (type)
attenuation(1500-1625Mhz):	42dB(min) 47dB(type)
attenuation(1625-1650Mhz):	40(min) 43(type)
attenuation(1650~1725MHz):	35(min) 38(type)
attenuation(1725-1850Mhz):	35(min) 38(type)
attenuation(1850-2000Mhz):	30(min) 35(type)
attenuation(2000-3000Mhz:	30(min) 35(type)
VSWR(157.22-1576.62:	1.2(TYPE) 1.6(MAX)
Input-output Impedance:	50ohm

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hanse-john electronic Co.,Ltd.

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Product Details
Company Profile

HDF1575M P2 Saw Bandpass Filter

1. Features

·SAW filter for GPS.

·High stability and reliability with good performance and no adjustment.

·Narrow and sharp pass band characteristics.

·Low insertion loss and deep stop band attenuation for interference.

·Low – loss SAW filter for GPS.

2. ELECTRICAL SPECIFICATION

Items	Conditions
Operation temperature rang	-30℃ ~ +85℃
Storage temperature rang	-40℃ ~ +85℃
ESD voltage Sensitive discharge device	ESD(MM) : 50VDC ESD(HBM) : 175VDC
DC Voltage VDC	5V
Max Input Power	15dBm 2000h
Moisture Sensitivity Level	MSL 2

2-1.Electrical characteristics

AT 25℃±5℃

Items	Test Condition	Min	Typ	Max	Unit
Center Frequency	-	-	1575.42	-	MHz
Insertion Loss	F0±1.2 MHz	-	0.9	1.3	dB
Ripple Level	F0±1.2 MHz	-	0.1	0.5	dB
Attenuation	D.C~1425MHz	30	35	-	dB
	1425~1500MHz	38	42	-	dB
	1500~1525MHz	42	47
	1625~1650MHz	40	43	-	dB
	1650~1725MHz	35	38
	1725~1850MHz	35	38	-	dB
	1850~2000MHz	30	35	-	dB
	2000~3000MHz	30	35	-	dB
VSWR	1574.22~1576.62MHz	-	1.2	1.6	-
Input/Output Impedance	-	-	50	-	ohm

2-2.Typical frequency response

5. ENVIRONMENTAL CHARACTERISTICS

5-1 High temperature exposure

Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.

5-2 Low temperature exposure

Subject the device to -40℃ for 16 hours. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.

5-3 Temperature cycling

Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high

temperature of +85℃ for 30 Minutes. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall meet the specifications in 2-2.

5-4 Resistance to solder heat

1,immerge the solder bath at 260℃ for 10 sec

2,the iron at 370℃ for 3 sec)

5-5 Solderability )

Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than

95% area of the soldering pad must be covered with new solder. It shall meet the

specifications in 2-2

5-6 Reflow soldering

The specimen shall be passed through the reflow furnace with the condition shown in

the above profile for 1 time.

The specimen shall be stored at standard atmospheric conditions for 1h, after which

the measurement shall be made. Test board shall be 1.6 mm thick. Base material shall be

glass fabric base epoxy resin.

5-7 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device

shall fulfill the specifications in 2-2.

5-8 Vibration

Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of

1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2-2.

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of

the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component. Please

avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be solded. Please avoid soldering another part of

component.

7. Packing

7.1 Dimensions

(1) Carrier Tape: Figure 1

(2) Reel: Figure 2

(3) The product shall be packed properly not to be damaged during transportation and storage.

7.2 Reeling Quantity

3000 pcs/reel φ 178mm

10000 pcs/reel φ 259mm

7.3 Taping Structure

(1) The tape shall be wound around the reel in the direction shown below.

(2) Label

Device Name
Marking
User Product Name
Quantity
Lot No.

(3) Leader part and vacant position specifications.

Product Tags:

HDF1575M P2 Saw Bandpass Filter

1575.42MHZ Saw Bandpass Filter

1575.42MHZ Saw And Baw Filters

HDF1575M P2 Saw Bandpass Filter

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