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| Categories | Jedec Matrix Trays |
|---|---|
| Brand Name: | Hiner-pack |
| Model Number: | Jedec standard tray 322.6*135.9*7.62&12.19mm |
| Certification: | ISO 9001 ROHS SGS |
| Place of Origin: | Made In China |
| MOQ: | 1000 pcs |
| Price: | $1.35~$2.38(Prices are determined according to different incoterms and quantities） |
| Payment Terms: | T/T |
| Supply Ability: | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time: | 5~8 working days |
| Packaging Details: | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material: | MPPO |
| Color: | Black |
| Temperature: | 125°C |
| Property: | ESD,Non-ESD |
| Surface resistance: | 1.0x10E4~1.0x10E11Ω |
| Flatness: | less than 0.76mm |
| Clean Class: | General and ultrasonic cleaning |
| Incoterms: | EXW,FOB,CIF,DDU,DDP |
| Use: | Transport,Storage,Packing |
| HS Code: | 39239000 |
| Company Info. |
| Shenzhen Hiner Technology Co.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.
Industrial Use:Electronic
Feature:Recyclable
Custom Order:Accept
Place of Origin:Shenzhen, China (Mainland)
Brand Name:Hiner-pack
Model Number:HN1890
Surface resistance:10e4-10e11 ohms
Color:Black
Property:Antistatic/ESD
Thickess:7.62mm
CAD drawing:available
Customized:width, length, thickness as customer request
Offer Designing:Yes
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN 1890 | Package Type | BGA IC |
| Cavity Size | 6*8*1 mm | Matrix QTY | 24*16=384PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Product Application
Electronic component Semiconductor Embedded System Display technology
Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply
Reference to temperature resistance of different materials
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days
around.
Q4: How about batch order production?
Ans: Normally 5-8days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and
ruled by our QC staff.
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