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Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module

Categories Jedec IC Trays
Brand Name: Hiner-pack
Model Number: HN18102
Certification: ISO 9001 ROHS SGS
Place of Origin: Made In China
MOQ: 1000 pcs
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day
Delivery Time: 5~8 working days
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Material: PPE
Temperature: 125°C
Property: ESD
Surface resistance: 1.0x10E4~1.0x10E11Ω
Flatness: less than 0.76mm
Incoterms: EXW,FOB,CIF,DDU,DDP
Customized service: Support standard and non-standard,precision machining
Injection mold: Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.)
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Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module

Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module
PPE Jedec Trays With Different Cavity Can Be Customized For PCBA
Quick Description:

Outline Line Size322.6*135.9*7.62mmBrandHiner-pack
ModelHN 18102Package TypePCBA
Cavity Size35*35*3.05mmMatrix QTY3*7=21PCS
MaterialPPEFlatnessMAX 0.76mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS
1. Standard Jedec Tray Outline size is 322.6X135.9X7.62mm or 322.6*135.9*12.19mm.
2. The production process is injection molded products.
3. Rich experience and mature design team in the field of injection molding products, providing one-stop services from design to mold to product packaging
While the Jedec Tray is widely used in the semiconductor industry, the PCB module market is slowly recognizing and using custom trays to transport and load modules, because it can not only fully meet customer requirements in terms of performance, but also match the market demand for high-end modules. The IC Tray has been fully recognized in different industries.We have accumulated a wealth of experience in loading different IC and modules, and have produced many similar series of trays.

Product Application


Package IC PCBA module component

Electronic component packaging Optical device packaging



Packaging


Packaging Details:Packing according to customer's specified size


Reference to temperature resistance of different materials

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.


Cheap Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module for sale
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