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High Efficent Smd LED Chip 1W 200lm W5054 For Street Light

Categories LED Chip 1W
Brand Name: PHOENIX
Model Number: 5054
Certification: LM80 CE ROHS
Place of Origin: SUZHOU
MOQ: 4000PCS
Price: Negotiation
Payment Terms: Western Union, MoneyGram, T/T
Supply Ability: 800KK PER MONTH
Delivery Time: 7-10 DAYS
Packaging Details: 4000PCS /ROLL
Name: SMD LED 5054
Application: Street light
Luminous Flux(lm): 200lm
nput Voltage(V): 3V
Power: 300MA
CCT: 6500k
Warranty(Year): 2 years
Working Time (hours): 20000
Operating Temperature(℃): -40-85
Viewing Angle(°):: 120
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High Efficent Smd LED Chip 1W 200lm W5054 For Street Light

Application Introduction:


1. According to the height of street lamp: high pole lamp, middle pole lamp, road lamp, courtyard lamp, lawn lamp and buried lamp;

2. According to the material of street lamp pole: hot-dip galvanized iron street lamp, hot-dip galvanized steel street lamp and stainless steel street lamp;

3. According to the light source of street lamp: sodium lamp, street lamp, LED street lamp, energy-saving street lamp and new soming xenon street lamp.


5054 smd led chip for street light high efficent 3v 200lm/w​


Quick details:


Input Voltage(V):3V
Warranty(Year):2-Year
Type:Smd Led Chip 2835
Lighting solutions service:Lighting and circuitry design
Luminous Efficacy(lm/w):200
Lifespan (hours):50000
Working Time (hours):20000
Chip Material:INGAN
Emitting Color:6000-6500K
Power:1w
Viewing Angle(°):120 Degree
Color Rendering Index(Ra):80
Packing bag:430*450nm
Place of Origin:Suzhou ,jiangsu
Application:Street light
Package Type:Suface Mount Package
Forward Current:300MA
Size:5.4*5*0.8mm
Packing:4000 Pcs/Roll


Product specification:

Package Structure

Absolute Maximum Ratings


ItemSymbolAbsolute Maximum RatingsUnit
Forward CurrentIF180mA
Reverse VoltageVr5V
Pulsed Forward CurrentIFP*200mA
Power dissipationPD1.2W
Operating TemperatureTOP-40~85
Storage TemperatureTST-40~85
Electrostatic DischargeESD2000(HBM)V
Junction TemperatureTj120
LED Thermal resistanceRth s-j33℃/W

Typical Electro-Optical characteristics curves:

LED Reliability Test List


Test ItemTest ConditionsStandardQty(Pcs)Ac/Re
Life Test25℃,1000Hrs@180mA/200/1
High Temperature85℃,1000Hrs@180mA/200/1
Low Temperature-40℃,1000Hrs@180mA/200/1
High Humidity Heat

85℃,85%RH,

1000Hrs@180mA

/200/1
Low Temperature Storage-40℃,1000Hrs

JEITA ED-4701

200 202

200/1
High Temperature Storage100℃,1000Hrs

JEITA ED-4701

200 201

200/1
Temperature Cycle(-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min)

JEITA ED-4701

100 105

200/1
Thermal Shock-40'C(15mins) --100'C(15mins),changing time <5mins ,300CMIL-STD-202G200/1

Pulse Life Test


Tp=1ms,DC=0.1,D=Tp/T @ 3×180mA/200/1
ESD Test(HBM)2000V,200V/Step, Forward & Reverse Test both 3times

AEC

(Q101-001)

200/1
Soldering Resistance

260±5℃,10S,3times

Pre-treatment 30℃,70%RH

JEITA ED-4701

300 302

200/1
Reflow IV Decay

260±5℃,10S,1time

Pre-treatment 30℃,70%RH,168Hrs

/200/1
Judgment Criteria
Forward Voltage VFVF Max-Increase < 1.1x
Reverse Current IRIR Max-Increase < IRmax
Luminous Intensity IVIV Decay < 40%

※Solder ability test criteria:coverage is not less than 95%

Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours)


Packaging:

Cautions:

The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the

Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.


Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times

SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following

Handling Precautions :
Handle the component along the side surface by using forceps or appropriate tools
Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry



Product features:


Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation

High brightness ,low attenuation high color rendering

Minimum 70,80,90 95 CRI options

Strong welding and good stability undead light

Product series and company logo on the front

CE ROHS LM80 Certification


Production Process:



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