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FR4 PI Circuit Board Rigid Flex Printed 10 Layer PCB

Categories Rigid Flex PCB
Brand Name: WITGAIN PCB
Model Number: Rigid-Flex PCB0002
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
Place of Origin:: Guangdong China
Material:: FR4+PI
No of layers:: 10 Layers
Solder mask colour:: Blue
Surface technics:: ENIG 2U'
Min Lind Space&Width:: 3/3mil
Board Size: 180mm*120mm
Min BGA Size: 9mil
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FR4 PI Circuit Board Rigid Flex Printed 10 Layer PCB

Rigid Flex Printed Circuit Board 10 Layer Pcb FR4 And PI Material Laminated


  • Main Features:

1 10 Layer rigid flex printed circuit board.

2 FR4 material and PI material laminated.

3 Finished pcb thickness is 1.0mm.

4 Blue solder mask and white legend.

5 Board size is 240mm*125mm/2pcs.

6 Min hole size is 0.25mm.

7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

8 Layer 4 to Layer 7 are flexible layers. Balance layers are rigid layers.

9 Surface treatment is immersion gold.


  • Our Production Capabilities:

NOItemCapability
1Layer Count1-24 Layers
2Board Thickness0.1mm-6.0mm
3Finished Board Max Size700mm*800mm
4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
5Warp<0.7%
6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8Drill Hole Diameter0.1mm-6.5mm
9Out Layer Copper Thickness1/2OZ-8OZ
10Inner Layer Copper Thickness1/3OZ-6OZ
11Aspect Ratio10:1
12PTH Hole Tolerance+/-3mil
13NPTH Hole Tolerance+/-1mil
14Copper Thickness of PTH Wall>10mil(25um)
15Line Width And Space2/2mil
16Min Solder Mask Bridge2.5mil
17Solder Mask Alignment Tolerance+/-2mil
18Dimension Tolerance+/-4mil
19Max Gold Thickness200u'(0.2mil)
20Thermal Shock288℃, 10s, 3 times
21Impedance Control+/-10%
22Test CapabilityPAD Size min 0.1mm
23Min BGA7mil
24Surface Treatment

OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc



  • FAQ:

Q1: What is HASL - Hot Air Solder Leveling?

A1:


HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.

The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.

The HASL Coating is applied as per the steps below:

  1. The process starts with the immersion of the PCB board into a molten tin/lead solution, where all exposed copper area is covered by this solution.
  2. After that, a Hot Air Leveler (HAL) ensures the uniformity of solder deposit by removing the excess solder from the PCB board, using high pressure hot air knives. The purpose of this is to leave a uniform and thin possible layer on the board.
  3. This coating protects the copper traces from corrosion until the board goes in for the assembly process.

Advantages of HASL:

  • Resistance to copper corrosion
  • Excellent wetting capability during the soldering process
  • Provides excellent quality solder joint (solderability) by making component soldering more effective
  • Economical
  • Can be re-worked easily
  • Suitable for Lead-free PCBs
  • Reduce the chances of PCB failure

Limitations of HASL:

  • It offers high thermal stress to the PCB, which results in defects.
  • Due to the inconsistent thickness of HASL coating, it’s not a feasible solution for SMT component placement.
  • Not suitable for PTH (Plated Through Hole) components.
  • Less environment-friendly
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