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Categories | Electronic Components IC Chips |
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Brand Name: | ADI / MAXIM |
Model Number: | ADG658YCPZ-REEL7 |
Place of Origin: | original |
MOQ: | 1 |
Price: | Negotiable |
Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability: | 999999 |
Delivery Time: | 1-3 days |
Packaging Details: | standard |
Multiplexer/Demultiplexer Circuit: | 8:1 |
On-State Resistance (Max): | 75Ohm |
Channel-to-Channel Matching (ΔRon): | 12Ohm (Max) |
Voltage - Supply, Single (V+): | 2V ~ 12V |
Voltage - Supply, Dual (V±): | ±2V ~ 6V |
Switch Time (Ton, Toff) (Max): | 115ns, 45ns |
PN: | ADG658YCPZ-REEL7 |
ADG658YCPZ-REEL7 Electronic Components IC Chip 8-Channel Analog Multiplexers
Package 16-LFCSP-VQ
Product Status | Active | |
Switch Circuit | - | |
Multiplexer/Demultiplexer Circuit | 8:1 | |
Number of Circuits | 1 | |
On-State Resistance (Max) | 75Ohm | |
Channel-to-Channel Matching (ΔRon) | 1.3Ohm | |
Voltage - Supply, Single (V+) | 2V ~ 12V | |
Voltage - Supply, Dual (V±) | ±2V ~ 6V | |
Switch Time (Ton, Toff) (Max) | 115ns, 45ns | |
-3db Bandwidth | 210MHz | |
Charge Injection | 2pC | |
Channel Capacitance (CS(off), CD(off)) | 4pF, 23pF | |
Current - Leakage (IS(off)) (Max) | 200pA | |
Crosstalk | - | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Mounting Type | Surface Mount | |
Package / Case | 16-VQFN Exposed Pad, CSP | |
Supplier Device Package | 16-LFCSP-VQ (4x4) |
Title: ADG658YCPZ-REEL7 IC Chip
Brand: Analog Devices
Model: ADG658YCPZ-REEL7
Description: The ADG658YCPZ-REEL7 is a low-voltage, CMOS
single-pole/single-throw (SPST) analog switch IC chip designed for
various electronic applications.
Features:
Low on-resistance
Wide voltage range compatibility
Low power consumption
Fast switching speed
Low leakage current
Applications:
Audio and video signal routing
Data acquisition systems
Communication systems
Test and measurement equipment
Industrial automation
Specifications:
Number of Channels: 1
On-Resistance: Low
Voltage Range: Wide
Supply Voltage: Varies
Operating Temperature: Varies
Package: LFCSP (Lead Frame Chip Scale Package)
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