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Multipurpose Thermal Liquid Gap Filler Anti Seismic

Categories Liquid Gap Filler
Brand Name: AOK
Model Number: TF300
Certification: RoHS, Reach, UL
Place of Origin: China
MOQ: 400 ml (200 ml each part)
Payment Terms: T/T
Delivery Time: 13-15 working days
Packaging Details: 50 ml (25ml each part)/400 ml (200 ml each part)/ 20kg(10kg each part)
Product Name: Light Blue Thermal Conductive Liquid Gap Filler Silicon Pad Gel For Cooling LEDs
Composition: Ceramic filler + Silicone
Color: Light Blue
Density: 3(g/cc)
Usage Temperature: -40 ℃ ~ 150 ℃
Flammability: V-0
Thermal conductivity: 3.0 W/m.K
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Multipurpose Thermal Liquid Gap Filler Anti Seismic

Light Blue Thermal Conductive Liquid Gap Filler Silicon Pad Gel For Cooling LEDs


AttributeValueTest Method
CompositionCeramic filler + Silicone-
Color/Component AWhiteVisual
Color/Component BLight BuleVisual
Density(g/cc)3ASTM D792
Usage Temperature(℃)-40~150--
Electrical
Breakdown Voltage(kv/mm)≥7.0ASTM D149
Dielectric Constant(@10mhz)7.3ASTM D150
Volume Resistivity(Ω.cm)1.0*1013ASTM D257
FlammabilityV-0UL94
Thermal
Thermal conductivity(W/m.K)3.0ASTM D5470
Viscosity/Component A (cps)400000ASTM D2196
Viscosity/Component B (cps)400000ASTM D2196
Hradness,after cure(shore OO)40ASTM D22240

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5 W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications


Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays


Two-part dispensable gap filler

Liquid Gap Filler is a soft silicone-based thermal gap filler material with high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the radiator/housing, etc., to make them come in close contact, reduce thermal resistance, and quickly and effectively reduce the temperature of the electronic components, thereby prolonging the service life of the electronic components and improving their reliability.


Purchase information
Packing specification: 50 ml(25 ml each part) / 400 ml(200 ml each part)/20kg (10kg each part)


Directions for use
• Working hours @ 25
C : 1 hour
• Dry to touch @ 25
C : 1 hour
• Full cure @ 25
C : 12-16 hours
• Full cure @ 100
C : 1 hour


Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.


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