Effortless Dispensing with Touch Screen Controlled PUR Piezo Valve and Heating Modules

Barrel Heating Module Touch Screen Controls PUR Piezo Valve

Principle & Control

PUR Piezo Valve
1. The PUR Piezo valve consists of barrel heating module, pressurized cap module, nozzle heating module, runner module, valve body module and heat dissipation module.
2. The barrel heating module carries the barrel and a section of heating, temperature controllable, to complete the initial heating of the gel.
3. The pressurized cap module seals and pressurizes the barrel and controls the output pressure through the controller.
4. The heat dissipation module dissipates the heat and reduces the noise of the valve body.
5. Piezo-electric injection valve adopts modular design, the part in contact with the gel is designed as runner module, and the part not in contact with the gel is designed as valve body module.
6. In different applications, the runner module can be replaced to meet the dispensing needs.
7. Nozzle diameter (from 0.03MM to 0.80MM). Nozzles are available in flat jet, needle, and extension types.
8. Runner modules need to be cleaned regularly in an ultrasonic cleaner. Seals should not be immersed in organic solvents. Special tools are required to clean the nozzles to prevent damage to the nozzles.

Nozzle and drum heating

1. The nozzles need to be heated to a suitable temperature before glue dispensing. The heating device adopts a two-stage heating method.

2. Heating at the barrel and nozzle maintains the constant temperature of the glue to meet the optimum performance of the glue.

Specification

Product Features and Advantages

1. Tube heating is suitable for 300CC aluminum tube special hot melt glue.
2. Modular design, easy to replace parts, debugging is simple, the process of a wider range of applications
3.Spraying volume can be accurate to 0.3nL, spraying glue point consistency accuracy is as high as 98%.
4. Minimum 0.17mm line width, minimum 0.15mm spot diameter hot melt adhesive spraying process can be realized.
5. Can match any motion platform on the market.

Application Field

Bonding and sealing of cell phone shells, encapsulation of new energy batteries, bonding and sealing of contact screens for various electronic products, encapsulation of cell phone speakers and receivers, encapsulation of high-end headphones and audio shells, encapsulation of fingerprint identification modules.

Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional technical team for R&D,but also have a outgoing and experienced marketing team for research and develop, grasps products developing directions, updates the products and technics to meet the continue changing demands. In the past years,we have been always keep innovating and exploing to make cost-efficient products to help our customers saving cost and labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the concept of "Quality-Oriented and Customer-orented", and combined the industry feature, smart technology persuit for the smart factory.As for the after-sale service, we insist on "responsibility", we will take reaction at the first when we got quality feedbacks,and service our customers all the time.