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M2020 AOI Automated Visual Inspection Equipment In SMT

Categories AOI Tester
Brand Name: MENTO
Model Number: M2020
Certification: FCC.ROHS,CCC
Place of Origin: DONGGUAN
MOQ: 3
Supply Ability: 10pcs+20 work days
Delivery Time: 20 work days
Packaging Details: W1350xD1000xH1600mm
Application: PCB Inspection
Inspection Speed: Up to 25 cm²/s
Operating System: Windows
Type: Automated Optical Inspection
Power Supply: 110-240V AC
Camera Type: High-Resolution CCD
Model: Tester
Connectivity: Ethernet
Resolution: 10 μm
Lighting: LED
Software: Intuitive GUI
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M2020 AOI Automated Visual Inspection Equipment In SMT

M20 Series Mini LED appearance inspection


ModelM2020
InspectionInspection itemsMissed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity
Inspection methodImage processing, machine learning
Optical SystemCamera20MP
LensHigh resolution bi-telecentric lens
Resolution4μm(2.4μm~10μm optional)RGB(Customisable)
Light SourceRGB customizable
EfficiencyStop then go:3FOV/s
Computer ConfigurationPCCPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6GB SSD:250G, HDD:2T
Monitor22 "LED
Operating SystemUbuntu
Inspection PerformancePCB Thickness1~5mm
Maximum allowable component heightUpper 20mm, Lower 30mm(Customizable)
DriverServo motor+Screw guide
Movement speedMax:600mm/s
PCB fixture height900+20mm(from floor to fixture surface)
ParametersPCB sizeMax:600mmx500mm(single track, track width adjustable)
PowerAC220W50Hz2000W
DimensionsW1350xD1000xH1650mm(without alarm light)
Weight≈1100KG
Air Pressure Requirement≥0.5Mpa
Environmental requirementsTemperature:5~40℃, RH 25%~80%(no frost)
Upstream and downstream equipment communicationStandard SMEMA interface / data communication with die bonder

Pad measurement/Pad inspection /Solder paste printer/SPI/Die bonder/Pre-reflow AOI/

Reflow oven/Post-reflow AOI /Luminescence inspection/Colloid inspection/Laser Marker/Rework


Scientific platform design

Ultra-high precision global calibration technology ensures the accurate measurement of component displacement, tilt, and collinearity anomalies, and further yields quantitative results.


Micron-level Motion Control Capability

Closed-loop control system ensures position accuracy of 1um.

Electronic IO control

Long service life, stable and noiseless: LED light status indication.



Offset value output Angle value output

Collinearity detection (collinearity, absolute distance, collinearity range, right spacing)


Vision system

Industrial camera

High Precision High Frame Rate Industrial Camera.

Telecentric optical system

High depth of field, low distortion, full pixels, fixed resolution design.

Constant current light source controller

The fully closed-loop constant current digital controller ensures the stability and uniformity of light source brightness.


Image preprocessing (IPE)


A variety of image preprocessing, supporting customized IPE (composed of operator .()+-*/| and IPE expression),

which can better highlight image features.


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