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Customized Automatic Wave Soldering Machine Lead Free 3 Phase 5 Wire 380V

Categories SMT Reflow Oven
Brand Name: CNSMT
Model Number: CN088
Certification: CE
Place of Origin: china
MOQ: 1
Price: negotiation
Payment Terms: T/T, Western Union
Supply Ability: 10pcs/day
Delivery Time: 5-7 work days
Packaging Details: woodenbox
Brand:: CNSMT
MODEL: CN088
Weight:: 670KG
Lead Time:: IN Stork
Packing:: WOODENBOX
POWER: 3-phase 5-wire 380V
PCB WIDTH: 50-350MM
PAYMENT TERM: T/T, Paypal, Westernunion are all allowed
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Customized Automatic Wave Soldering Machine Lead Free 3 Phase 5 Wire 380V


CNSMT WAVE SOLDERING MACHINE


Speifications
Thermal systemPreheating length1800mm
 Preheat zone number2
 pre-heat temperature-250℃
 Preheat power10KW
 Thermal compensation power2.5KW
 PCB transport width50-350mm
 PCB transportation heightMax.100mm
Transportation SystemPCB transport speed0-1.8m/min
 PCB transport angle3-7°
 PCB transportation directionLeft → Right or Right → Left
 Solder typeLead-free
 Solder capacityMax.450KG
Solder systemTin furnace temperatureRoom temperature -400°C
 Tin furnace power10KW
 Tin furnace temperature controlPLC+SSR
 Flux capacity20L
Spray systemFlux consumption10-100ml/min
 Spray head movement modeRodless cylinder
 Power2P
cooling systemCooling temperature5-8°C
 Cooling speed6-8°C/sec
 power supplyThree-phase five-wire system (380V 50/60HZ)
 Starting powerMax.26KW
 Normal operating power12KW
Machine parametersGas source0.5MPa
 weight2300KG
 size4400X1620X1710mm


Application


crafting process

After the board enters the wave soldering machine through the conveyor belt, it passes through some form of flux coating device where the flux is applied to the board by means of crests, foaming or spraying. Since most fluxes must reach and maintain an activation temperature during soldering to ensure full solder joint penetration, the board must pass through a preheat zone before entering the crest. Preheating after flux application can gradually raise the temperature of the PCB and activate the flux. This process also reduces the thermal shock that occurs when the assembly enters the peak. It can also be used to evaporate all possible absorption of moisture or carrier solvents that dilute the flux. If these things are not removed, they will boil over the peak and cause solder sputter, or steam will remain inside the solder to form a hollow. Solder joints or trachoma. In addition, because the heat capacity of double-sided and multi-layer boards is larger, they require a higher preheating temperature than a single panel.


At present, wave soldering machines basically use heat radiation for preheating. The most commonly used wave soldering preheating methods include forced hot air convection, convection of electric heating plates, heating of electric heating bars and infrared heating. In these methods, forced hot air convection is often considered to be the most efficient heat transfer method for wave soldering machines in most processes. After preheating, the board is soldered with single-wave (lambda) or double-wave (spoiler and lambda) waves. A single wave is sufficient for a piercing element. When the circuit board enters the peak, the direction of solder flow is opposite to the direction of travel of the board. Eddy currents can be generated around the component pins. This is like a scrubbing process that removes all of the above flux and oxide film residues and forms infiltration when the solder joint reaches the infiltration temperature.

For mixing technology assemblies, spoiler waves are generally used before lambda. This kind of wave is narrow, with high vertical pressure during perturbation, which allows the solder to penetrate well between the compact pin and the SMD pad, and then uses λ waves to complete the solder joint formation. . Before making any assessment of future equipment and suppliers, it is necessary to determine all the specifications of the board soldered with the wave peaks, as these can determine the performance of the required machine.

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