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| Categories | Arlon PCB Board |
|---|---|
| Brand Name: | BICHENG |
| Model Number: | BIC-00002-V2.0 |
| Certification: | UL |
| Place of Origin: | CHINA |
| MOQ: | 1 piece |
| Price: | Negotiable |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 50000 pieces per month |
| Delivery Time: | 8 working days |
| Packaging Details: | 12kg per carton, 31*27*20cm |
| Base material: | RO4350B |
| Tg: | 288 |
| Layer count: | 2 layers |
| Solder mask: | Green |
| Surface finish: | Immersion gold |
| PCB thickness: | 0.6mm |
| Copper weight: | 1oz |
High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB for Splitter
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
PCB parameter
| PCB SIZE | 26 x 83mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB, 2 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | no |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
| RO4350B 20mil (0.508mm) | |
| copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.98mil/6.18mil |
| Minimum / Maximum Holes: | 0.3/3.2mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 431 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | no |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 20mil (0.508mm), Tg 288℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.6mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (81.1%) 2µ" over 100µ" nickel |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
1. RO4350B substrate. Excellent high frequency performance due to low dielectric tolerance and loss.
2. Stable electrical coefficient of dielectric constant.
3. PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
4. Meeting your printed circuit board needs from PCB prototyping to mass volume production.
Appendix: Data sheet of RO4350B
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
|
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