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High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

Categories Thermally Conductive Electrical Insulator
Brand Name: Ziitek
Model Number: TIS800
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/pcs
Delivery Time: 3-6 work days
Packaging Details: 24*23*12CM
Product name: High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling
keyword: Heat Conduction Insulating Gasket
Application: Chip heat sink,Semiconductor Device Cooling
continous use temp: -45 to 180℃
compliance: UL & RoHS
Materials: Ceramic filled silicone elastomer / Fiberglass
Feature: Low thermal resistant with high voltage isolation
Thermal conductive: 1.6W/mK
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High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


The TIS™800 Series is acomposite of silicone rubber and fiberglass .Thematerial is flame retardant and is specially formulated for use asa thermakky conductive insulator,The primary use for TIS800 isto electrically isolate power sources from heat sinks.TIS 800 hasexcellent mechanical and physical characteristics.Surfaces arepliable and allow complete surface contact with excellent heat.


TIS800-Series-Datasheet (1).pdf


Features:
> Highly compliant surface characteristic with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:
> Power conversion equipment
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components


Typical Properties of TIS™800 Series
Product NameTIS800Test Method
ColorGrayVisual
Construction &CompostionCeramic filled silicone elastomer /fiberglass******
Thickness range0.127mm-0.457mmASTM D751
Hardness65 Shore AASTM 2240
Specific Gravity2.2 g/ccASTM D297
Tensile Strength>1500 psiASTM D412
Continuos Use Temp-45 to 180℃***
Dielectric Breakdown Voltage>1500 VACASTM D149
Dielectric Constant5.5 MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity1.6 W/m-KASTM D5470

Product Thicknesses

TIS 805: 0.127mm

TIS 806: 0.152mm

TIS 808: 0.203mm

TIS 810: 0.254mm

TIS 812: 0.304mm

TIS 818: 0.457mm


Product Sizes
8" x 160"(203mm x 48.76M)

Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.

Reinforcement:
TIS™ series sheets are fiberglass reinforced.


Packaging Details & Lead time


1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Independent R&D team


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A:1. Click the "Sent messages" button to continue with the process.

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4. We will reply you as soon as possible with Email or online.

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