Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

TIS680-10AB-Specification-sheet.pdf

Features

> Good thermal conductive: 1.0W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

Application

>To potting LED Lighting heat spreader and power- driver.
>Ferrite cements; tip type LED; good cementation to aromatic polyester

>Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics

>Power transformers and coils; Potting capacitors; Potting of small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion; Coatingand sealant; Coil ; IGBTS;Transformer; Fire retardant
>Optical / medical component adhesive